![]() (Source: Intel)Īlso at the investor day, Intel CEO Bob Swan sketched out the company's plans and goals over the next several years. ![]() Intel says its targeting a much larger total addressable market in the “data-centric” era. Renduchintala also said Intel's future performance gains will be driven by innovations in six areas: process and packaging, architecture, memory, interconnect, security and software. "Intel is expanding the formula of integration well beyond the single die," he said. ![]() This will involve the incorporation of new process technologies and new packaging technologies to integrate individual IC blocks - or chiplets - into a heterogeneous device. Renduchintala said Intel is undergoing a transition from its historical "tick-tock" cadence of chip scaling toward a new model of innovation that goes beyond brute-force scaling. The company is targeting a 7-nm+ process in 2022 and a 7-nm++ in 2023. The technology, which is expected to be available next year, is an early example of a broader push by the semiconductor industry toward heterogeneous integration - separately manufactured silicon and non-silicon components integrated into a three-dimensional system-in-a-package.Īs with prior nodes, Intel plans to release intra-node optimizations at 7 nm. Last December, Intel introduced Foveros, a new 3D packaging technology for face-to-face stacking of logic. "Intel is developing the world's leading portfolio of advanced packaging technologies," Renduchintala said. The 7-nm GPU will be available in Intel's advanced Foveros and EMIB packages, Renduchintala said. Renduchintala said Intel would increasingly shift from emphasizing transistor scaling and monolithic integration to emphasizing heterogeneous scaling and integration moving forward. It will follow the launch of Intel's first discrete GPU, which is expected next year. Intel's first 7-nm product is expected to be a general-purpose GPU for data center AI and high-performance computing based on Intel's Xe architecture. Renduchintala told investors that the company's 7-nm process technology is expected to provide about 20% increase in performance per watt with a 4x reduction in design rule complexity. Intel's delays at 10-nm have contributed to the company losing some market share to longtime PC processor rival AMD, which plans to begin shipping 7-nm chips later this year. Difficulties with ramping up the yield of 10-nm to acceptable production levels have caused a lengthy delay in the rollout of the chips, which were initially targeted for release in 2016. The timing of 10-nm shipments has been an issue that Intel has grappled with for more than a year. Renduchintala added that Intel plans to launch several 10-nm products in 20. Murthy Renduchintala, Intel's chief engineering officer and president of the company's Technology, Systems Architecture and Client Group, reiterated that Intel's first 10-nm processors to ship will be its Ice Lake notebook PC processors. 【PowerUP Asia 2023】WBG Technologies Toward Sustainability
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